Products

Silicon Materials & Silicon Parts

Siltree delivers high-quality semiconductor silicon parts and silicon materials, including columnar polysilicon and monocrystalline silicon, serving the world's leading etch equipment manufacturers.

Monocrystalline Silicon

Our monocrystalline material, already supplied in volume, is dislocation-free (without slip) with low oxygen (3-5ppma below OEM material) and head oxygen content of 12-14ppm, well ahead of industry standards.

Specifications

Diameter
330-400mm
Length
1800-2300mm
Purity
7N
Resistivity
0.005-85 Ω·cm
Oxygen
≤20ppma
Carbon
≤1ppma
Dislocation
Free
Dopant
Boron

Key Advantages

  • Dislocation-free (without slip)
  • Low oxygen: head 12-14ppm vs OEM 15-18ppm
  • Carbon not detected (ICP-MS)
  • All 20 key elements below detection limit
Monocrystalline silicon material
Hoisting a monocrystalline ingot - production floor
Monocrystalline ingot - top view
Monocrystalline silicon surface texture close-up

Third-Party Test Reports (Eurofins EAG)

Material quality verified by an accredited third-party laboratory

Third-party test report - oxygen 12ppm

Oxygen content

12 ppm wt

Third-party test report - carbon <5ppm

Carbon content

<5 ppm wt

Third-party test report - impurity element analysis

Impurity analysis

All 20 key elements <0.005

Cast polysilicon
Cast polysilicon block
Cast polysilicon cylinder
Polysilicon disc - diameter measurement

Polysilicon surface texture

Polysilicon texture - granular crystals
Polysilicon texture - vertical crystals
Polysilicon texture - crystal structure

Cast Polysilicon

Siltree's polycrystalline material is formed to OEM material standards, with overall appearance, sides, bottom and head all reaching industry-leading levels.

Specifications

Purity
6N
Resistivity
≤0.02 / 1-10 Ω·cm
Oxygen
≤10ppma
Carbon
≤10ppma
Density
2.33 g/cm³
Bending strength
140±20 MPa
Thermal conductivity
150±15 W/(m·K)
Dopant
Per customer spec

Silicon Parts

With a wide range of high-precision machining equipment, we provide a full-process service from material and machining to cleaning and cleanroom packaging.

UGR Silicon Ring

UGR Silicon Ring

Upper gas ring for etch equipment, precision-machined for uniform gas distribution.

Electrode

Electrode

A critical component of plasma etch equipment requiring high purity and precise dimensions.

Confinement Silicon Ring

Confinement Silicon Ring

Confinement ring that controls plasma distribution and etch uniformity.

Square Silicon Parts

Square Silicon Parts

Precision-machined square silicon parts for specific equipment applications.

Silicon Rod

Silicon Rod

High-purity silicon rod with precision-machined tip.

Confinement Ring (Detail)

Confinement Ring (Detail)

Detailed view of a confinement ring product.

Production capability infographic - large ingot pulling, columnar polysilicon ingots, precise resistivity control, silicon machining

Production Equipment

Advanced crystal pullers, casting furnaces and a range of precision machining equipment ensure stable, reliable product quality.

Core Equipment

  • Crystal puller
  • Polysilicon casting furnace
  • Wire saw
  • Coredrill
  • Grinder
  • Machining center
  • LAP/Polish machine
  • High-purity cleaning line
Crystal puller - ingot growth
Ingot casting furnace
Large grinding machine
Drilling machine

Factory Floor Layout

Factory floor layout diagram

Inspection Equipment

Comprehensive inspection capabilities ensure every batch meets strict quality standards.

Four-point probe resistivity tester
Four-point probe resistivity tester
Bruker FT-IR spectrometer
Bruker FT-IR spectrometer
ICP-MS laboratory
ICP-MS laboratory
Microscope inspection
Microscope inspection
Box (muffle) furnace
Box (muffle) furnace
High-purity cleaning line / cleanroom
High-purity cleaning line / cleanroom
  • CMM
  • 2D measuring system
  • Roughness tester
  • Resistivity tester
  • FT-IR Spectrometer
  • ICP-MS
  • Microscope
  • Box Furnace

Material Properties Comparison

Detailed physical properties of monocrystalline and polycrystalline silicon

PropertySingle crystalPolycrystal
Density2.33 g/cm³2.33 g/cm³
Bending Strength140±20 MPa140±20 MPa
Young's Modulus155±20 GPa160±10 GPa
Vickers Hardness9.2±2 GPa9.2±2 GPa
Coefficient of Thermal Expansion (CTE)4.2±0.5 E-6/°C [1100°C]4.2±0.5 E-6/°C [1100°C]
Thermal Conductivity140±15 W/(m·K) [20°C]150±15 W/(m·K) [20°C]
Thermal Diffusivity60±40 mm²/s [50°C]80±10 mm²/s [50°C]

Need a quote or technical advice?

Our technical team is ready to help. Contact us for detailed product specifications and pricing.

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